Quality & Sayi
Chipnets sun san akwai sassan karya da yawa a cikin duk sarkar samar da kayan lantarki, wanda zai haifar da munanan al'amura da mummunan sakamako ga abokan ciniki. Don haka, muna buƙatar ƙarfi don sarrafa ingancin kowane samfur dole ne ya kasance mai aminci da abin dogaro, sabo da asali kafin kaya.
Tsarin Gwajin Sashe Na Chipnets
Duban gani na HD
Gwajin bayyanar babban ma'ana gami da siliki allo, coding, Babban ma'ana gano ƙwallan solder, waɗanda zasu iya gano ko ɓarna ko ɓarna.
Gwajin Aikin Karshe
Yayin gwajin aiki ana kwatanta matakin ƙarfin lantarki na siginar fitarwa daga DUT zuwa matakan ma'anar VOL da VOH ta masu kwatanta aiki. Ana sanya ma'aunin fitarwa zuwa ƙimar lokaci don kowane fil ɗin fitarwa don sarrafa ainihin ma'ana a cikin zagayowar gwaji don ɗaukar ƙarfin wutar lantarki.
Buɗe/Gajeren Gwajin
Gwajin buɗewa/gajeren (wanda kuma ake kira ci gaba ko gwajin tuntuɓar) yana tabbatar da cewa, yayin gwajin na'urar, ana yin tuntuɓar lantarki zuwa duk fil ɗin sigina akan DUT kuma ba a gajarta siginar siginar zuwa wani fil ɗin sigina ko iko/ƙasa.
Gwajin Ayyukan Shirye-shiryen
Don gwada karatun, gogewa da aikin shirye-shirye gami da bincikar komai don kwakwalwan kwamfuta gami da ƙwaƙwalwar dijital, Microcontrollers, MCU da sauransu.
Gwajin X-RAY da ROHS
X-RAY zai iya tabbatar da ko wafer da waya bond da mutu bond yana da kyau ko a'a; gwajin ROHS shine ta hanyar kariyar muhalli na fil ɗin samfurin da abun ciki na gubar na rufin solder ta kayan aikin hotovoltaic.
Binciken Kimiyyar Kimiyya
Tabbatar da binciken kimiyya ko sashin karya ne ko kuma an sabunta shi.